BGA Rework Services — Lead-Free & Leaded Assemblies
BGA components fail silently. A missed reflow, a cold joint under a ball, or a botched reballing attempt can ground an entire production batch or, worse, escape into field product. Production engineers and procurement managers sourcing BGA rework in India need a vendor with controlled thermal processes, documented methodology, and honest warranty terms — not a generic repair shop with a hot-air gun and guesswork.
Hallmark Electronics has manufactured temperature-controlled soldering equipment in Pune since 1987. Our BGA rework service applies the same process discipline we build into our equipment: calibrated thermal profiles, traceability at each step, and a clear quality position before we hand the board back.
What Is BGA Rework?
Ball Grid Array (BGA) rework is the controlled removal, site preparation, and re-attachment — or replacement — of a BGA package on a populated PCB. Because all solder joints sit hidden beneath the package body, the process is entirely thermal and cannot be verified visually mid-operation. Every step depends on profile accuracy.
Common reasons boards arrive for BGA rework:
- Component failure confirmed by X-ray or functional test — package must be replaced
- Missing reflow — insufficient peak temperature or dwell time means balls did not coalesce; joints are open or cold
- Cold solder joints under BGA balls — high-resistance or intermittent connections (see our guide to cold solder joint causes and identification)
- Tombstoned or misaligned placement caught before functional test
- Reballing — removal of an otherwise functional IC from a damaged board for recovery and reuse
Lead-Free vs Leaded BGA Rework
Thermal profile requirements differ substantially between alloy systems. Mixing them without care causes reliability failures.
| Parameter | SAC305 / Lead-Free | SnPb 63/37 (Leaded) |
| Liquidus temperature | ~217 °C | ~183 °C |
| Typical peak (under package) | 235–245 °C | 205–215 °C |
| Soak window sensitivity | High — narrow process window | Moderate — wider window |
| Mixed-alloy risk | Bi-alloy joint if wrong profile used | Same |
| Flux chemistry | No-clean or water-wash, halogen-free options | Rosin or no-clean |
Mixed-alloy situations — where a lead-free ball array is being placed on a leaded board finish, or vice versa — require a profile deliberately designed for the alloy combination. We identify the board finish and component ball composition before profiling. For a detailed breakdown of lead-free profile construction, see our lead-free BGA rework profile guide.
Our BGA Rework Process
Each job follows a documented sequence. We do not compress steps under time pressure.
1. Incoming Inspection & Documentation
- Board identity, revision, and serial/batch number recorded
- Photograph of board condition pre-rework
- Failure mode noted: functional, X-ray, or visual evidence
- Alloy system confirmed (PCB finish, BGA ball composition)
2. Pre-Bake (Moisture Removal)
- Boards are baked per IPC-1601 guidelines to remove absorbed moisture before any thermal excursion
- Skipping pre-bake on unpackaged boards is a common cause of delamination and popcorning; we do not skip it
3. Component Removal
- Controlled top-side IR/hot-air preheat to bring the board to a defined soak temperature
- Uniform bottom-side pre-heat to minimise delta-T across the board plane
- Peak profile applied to bring the BGA site to reflow temperature within the defined window
- Component lifted with vacuum pick at the correct moment in the cooling curve — not forced
4. Site Cleaning
- Residual solder removed from pads using a temperature-controlled iron and wick or controlled vacuum desoldering
- Pads inspected under magnification; lifted pads or damaged mask documented and communicated to the customer before proceeding
- Flux residue cleaned with appropriate solvent
5. Reballing (Where Required)
- Package cleaned of old solder
- New balls placed using a reballing template matched to the BGA pitch and ball diameter
- Reflow of new ball array under controlled profile
- Ball height and co-planarity verified under magnification
6. Flux Application & Component Placement
- Site and package fluxed with flux compatible with the alloy system
- Package placed with visual or stencil alignment; self-alignment during reflow is only reliable if placement is already close
7. Reflow
- Profile executed using a calibrated rework system
- Thermocouple data logged for the job; available to customer on request
- Ramp, soak, time-above-liquidus, and cool-down rates all within specification for the alloy system
8. Post-Reflow Inspection
- Visual inspection of package seating and peripheral evidence of reflow
- X-ray inspection recommended (and offered) for confirmation of joint formation; bridging, opens, and head-in-pillow defects are not visible any other way
- Functional test co-ordinated with customer if test fixture is supplied
9. Outgoing Documentation
- Completed rework record: board ID, alloy system, profile data, inspector sign-off
- Post-rework photographs
- Any anomalies noted in writing
Warranty & Quality Position
BGA rework warranty terms need to be stated plainly, because the outcome of rework depends on factors only partially within the rework vendor’s control.
What we warrant:
- The rework process was executed to the documented procedure
- Thermal profile was within the specified window for the alloy system
- Site preparation met the criteria defined before work commenced
- Components were handled per moisture sensitivity level requirements
What we cannot warrant:
- Pre-existing PCB damage not visible or reported before rework
- Component functionality (a failed BGA may fail again if the root cause was device-level, not solder-joint-level)
- Board behaviour resulting from design or layout issues unrelated to the rework site
We communicate any concerns — lifted pads, suspect laminate, pad cratering risk — before proceeding, so you can make an informed decision. If a board is not a reasonable rework candidate, we will say so.
Defect liability: If a process error on our part is confirmed (e.g., profile deviation from the logged data, incorrect alloy handling), we will rework the board at no additional charge. The claim must be raised with the original job documentation.
Equipment Used
Hallmark has manufactured temperature-controlled soldering and desoldering equipment in Pune since 1987. Our own equipment is used in this service.
- Temperature-controlled rework stations from Hallmark’s Desoldering & Rework Stations range — closed-loop temperature control for consistent, repeatable thermal delivery
- Precision desoldering using the Hallmark TCS 450W Soldering and Desoldering station for site cleanup
- Calibrated hot-air / IR top-side heating with bottom-side pre-heat for board-level thermal management
- Thermocouple data logging — profile data retained per job
- Optical magnification for pad inspection, ball inspection, and placement verification
- X-ray inspection — available as an add-on for joint quality confirmation
Because we make the equipment, we understand its thermal behaviour in detail. We do not operate a black-box service.
Who We Serve
Our BGA rework service is suited to:
- EMS companies handling warranty returns or production escapes
- OEM production teams with low-to-mid volume rework needs that do not justify in-house BGA rework infrastructure
- R&D and prototype teams who need a single board turned around cleanly for evaluation
- PCB repair and depot repair operations handling field returns
- Procurement engineers sourcing a traceable, documented rework vendor in Pune or western India
We handle both single boards and small batch quantities. For recurring batch rework requirements, discuss a standing arrangement with our team.
Frequently Asked Questions
What warranty does BGA rework carry?
We warrant the rework process — that the procedure was followed, the thermal profile was within specification, and the board was handled correctly. We document every job and retain profile data. Process-related defects confirmed against that documentation are rectified at no charge. We do not extend warranty against pre-existing board damage or component-level failures unrelated to the joint.
What is a BGA rework station and why does it matter?
A BGA rework station is a controlled heating system — typically combining a top-side hot-air or IR nozzle with a bottom-side pre-heater — that allows a technician to apply a precise, programmable thermal profile to a BGA site on a populated board without disturbing surrounding components. The critical requirement is closed-loop temperature control: the station must hit and hold the defined ramp rates and peak temperature, not simply apply maximum heat. Stations without genuine closed-loop control produce inconsistent results and are a common source of thermal damage to neighbouring components or the PCB itself.
What causes a BGA missing reflow defect?
A BGA missing reflow occurs when the solder balls under the package did not reach liquidus temperature, or did not sustain it long enough for the balls to coalesce with the pad metallisation. The joints are either open or cold — electrically high-resistance or intermittent. Common causes include: an under-specified reflow profile (peak too low or time-above-liquidus too short), shadowing effects where a large thermal mass nearby draws heat away from the BGA site, moisture in the PCB or package causing outgassing that disrupts joint formation, or inaccurate thermocouple placement during profile development that masked actual under-temperature conditions. Missing reflow boards are recoverable if the pads and package are undamaged — the site is cleaned and the component is reflowed under a corrected profile.
What is lead-free BGA rework and how is it different from leaded?
Lead-free BGA rework uses SAC (tin-silver-copper) alloys, typically SAC305, which have a liquidus temperature around 217 °C — roughly 34 °C higher than eutectic SnPb. The process window is narrower: the peak must be high enough to fully melt the balls but not so high that it damages the component or the PCB. Ramp rates must be controlled more carefully because the higher temperatures increase the risk of delamination and pad lifting. Flux selection, pre-bake, and profile shape all differ from leaded practice. Using a leaded profile on a lead-free BGA produces cold or partially reflowed joints. For a complete profile construction guide, see our lead-free BGA rework profile article.
Can cold solder joints under a BGA be reworked without full removal?
In some cases, a controlled re-flow of the BGA in place — using an accurate thermal profile — will re-melt and reconstitute marginal or cold joints, avoiding the risk and cost of full removal and reballing. This is only appropriate where the component itself is known good, the ball array is intact, and there is no evidence of head-in-pillow or non-wet open defects (which require reballing). Whether an in-place reflow is the right approach is assessed case by case. Attempting in-place reflow without a calibrated profile risks compounding the defect. See also our article on cold solder joint causes and identification for the failure modes that distinguish a reflowable cold joint from one requiring component replacement.
Request a BGA Rework Quote
Tell us the board type, BGA package details, alloy system (lead-free or leaded), quantity, and the failure description. We will respond with a clear scope, turnaround estimate, and price.
Call or WhatsApp us:
- 📞 +91 8888827810 — 9 am to 5:30 pm IST
- 💬 WhatsApp +91 9325470470
- ✉️ info@hallmarkelctro.com
Or use the enquiry form on this page — include your board details and we will get back to you the same business day.
Hallmark Electronics | SR No. 46/A1/2, C-6, Sonawane Industrial Estate, Pune–Satara Road, Pune 411009 | Making precision soldering equipment in India since 1987.